X
  • Peking University
  • 中文
  • Campus
    • |
导航
X
  • Home
    • Events
    • Seminars
    • Notice
  • About
    • Welcome from the Dean
    • History
    • Organizational Structure
  • People
    • Introduction
    • EElab
    • School of Computer Science
    • School of Electronics
    • School of Integrated Circuits
    • School of Intelligence Science and Technology
  • Education
    • Teaching Information
    • Programs
  • Students
    • Career Prospects
    • Student Union
  • Collaboration
    • Domestic cooperation
    • International Communication
  • Alumni Center
    • Alumni work
    • Contact Us
    • Donation

Home

Home

  • Events

  • Seminars

  • Notice

Seminars
Location: Home > Seminars > Content
Current status, challenges and opportunities of semiconductor packaging technology
Date:2024-10-15 Clicks: Source:
主讲人 Hong Xie 时间 October 18th, 2024
地点 北京大学理教107

Prev：Thoughts on the Evolution of Database Optimizers Next：The Growth Path of the Native Generation in the AI Era

LINKS

  • Peking University
  • Peking University Undergraduate education
  • Peking University Office of International Relations
  • School of Computer Science
  • School of Electronics
  • School of Integrated Circuits
  • School of Intelligence Science and Technology

EECS

School of Electronics Engineering and Computer Science, Peking University Copyright © 2010-2019